Multitech MT9234SMI-HV-92 Specifications download pdf (Page 18)

CHAPTER 3 – UNIVERSAL DESIGN CONSIDERATIONS

Universal Socket Developer Guide

Multi-Tech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed

to exclude electromagnetic fields). Multi-Tech recommends that you use our packaging when returning a product

and when you ship your products to your customers.

USB Design Considerations

Multi-Tech recommends consulting Intel's High Speed USB Platform Design Guidelines, Rev. 1.0 for information

about USB signal routing, impedance, and layer stacking. Also:

 Shield USB cables with twisted pairs (especially those containing D+/D-).

 Use a single 5V power supply for USB devices. Consult your model’s Device Guide for Power Draw section for

current (ampere) requirements.

 Route D+/D- together in parallel with the trace spacing needed to achieve 90 ohms differential impedance

for the USB pair and to maintain a 20 mil space from the USB pair and all other signals.

 If power is provided externally, use a common ground between the carrier board and SocketModem.

Phone Line Warning Statement for the Developer Board

Use extreme caution when the phone line is installed due to live energized components. Do not touch any

components on the board while the phone line is installed.

Detach the phone line when making modifications to or servicing the developer board.

For other telephone warnings, refer to the Telecom Warnings

Mounting Hardware and Tooling Holes

Refer to individual Device Guide for specific hardware requirements.

Soldering

Multi-Tech uses a wave soldering process:

Solder pot temperature:

275C

Preheat zone 1:

135C

Preheat zone 2:

160C

Preheat zone 3:

175C

Belt speed:

35.4 inches per minute

Preheat zones have top and bottom heaters.

WARNING: Do not wash. Washing may damage the device.

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Multitech MT9234SMI-HV-92 Specifications Page 18